SIGRITY Advanced
Training
Sigrity's advanced package training class focuses on various analysis
methodologies of wire bond and flip-chip design. Come learn more on topics
that include PDS analysis of core and I/O rails and mixed PDS and I/O
package model extraction methodologies. We'll go over day-to-day problems,
such as issues associated with IBIS-based SSO analysis, differential pairs,
and IR drop. Explore theory, best practices, and advanced tool usage in
detail. And to help further assist you in using Sigrity's software, a
special section of the class is devoted to the identification and correction
of typical issues encountered with package analysis in the SpeedXP Suite.
This class is targeted for existing customers who want to maximize the
benefit of the Sigrity toolset within their design flow.
Course Outline
The course is 2 days.
Prerequisites
Note: Students must have previously attended the SpeedXP Foundation course or
have one year of experience with Sigrity tools.
Day One Overview and Principles of PDS and package-specific
modeling concepts
Translation and setup of wirebond and flip-chip packages
Core PDS analysis in the time and frequency domains
IBIS-based SSO analysis and advanced techniques
Signal integrity analysis with PRBS and eye diagrams
Day Two
Mixed PDS and I/O package model extraction
Conversion of S parameters with Broadband SPICE
SSO analysis using S parameter package models
Mixed-mode S parameter extraction for differential pairs
IR drop
Identification and correction of common setup issues
Sigrity’s roadmap
Laptop System
Requirements
Note:
You must bring your own laptop unless you have made
pre-arrangements with SIGRITY.
Advanced Training for IC Package Applications
RAM Memory 512 MB minimum
Processor speed Pentium 4 or Centrino 1.6 GHz
USB or a parallel port to attach a hardware key.
About 500 MB of free disk space for the software, manual, examples, etc.
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