190+ Sigrity customers use our software for a variety of high performance IC package and printed circuit board applications addressing the needs of design analysis across silicon-package-board. IC package physical design software speeds the implementation of single die designs as well as SiP and PoP implementations.

			Broadband Model Extraction Create broadband models for time domain circuit simulation with full-wave solver accuracy and models that are 2% of S-parameter model size.
			Chip-Package-Board Modeling Create ports for individual or grouped pins to achieve the desired level of abstraction when using models for either chip-centric or system-centric simulations.
			Current Density / IR Drop Rapidly identify hot spots in structures including vias, traces, planes, bond wires and solder balls to avoid hard-to-detect failures.  Optimize sense line placement.
			Co-Design Simultaneously simulate the entire chip power grid with the package / board in the time and frequency domain to find power integrity issues that are otherwise missed.
			Decap Optimization Assure power delivery system performance constraints are met while also targeting a decoupling scheme that is cost effective and conserves space.
			EMI / EMC Gain design stage visibility into potential hot spots with near and far-field radiation studies to compliment signal and power integrity analysis.
			High-Speed Interface Analysis Effectively deal with parallel (DDR) and serial (PCI-E) design challenges by analyzing system-wide behavior using SSO and channel studies.
			IO Planning Determine IO feasibility and assess implementation options across chip, package and board designs utilizing data from each of these environments.
			Package Layout Create manufacturing ready designs incorporating wirebond or flip-chip attachment using e-driven techniques to assure electrical constraints are met.
			Power Integrity Assure robust power delivery system performance and mitigate the impact of coupling between planes, traces, vias and other structures.
			RLCG Extraction Rapidly generate IBIS or SPICE RLCG single-stage models (including Pi or T circuits) for selected nets or entire designs that include coupling effects.
			Signal Integrity Analyze crosstalk, reflection, rise time degradation and related issues within a full system context to consider return path discontinuity with full wave accuracy.
			SiP Analysis and Design Extract models for the ever increasing range of multi-die implementation configurations, analyze the effect of noisy components and quickly create design layouts.
			S-parameter Extraction and Analysis Achieve the highest possible model accuracy and understand the most complex spatial relationships for complete package and board designs.
			SPICE Extraction and Analysis Generate models for use with SPICE compatible circuit simulators and enable practical design flows that accurately reflect power / ground plane effects.
			SSO / SSN Simulate ground noise propagation due to switching current under predicted and worst case conditions in the time or frequency domain for design improvement.