SIGRITY: XtractIM

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	Unified Package Designer
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XtractIM^TM is an integrated package extraction design environment for creating models that play a vital role in circuit and system-level power and signal integrity analysis. XtractIM helps IC package design teams build RLC IBIS or SPICE models more than 10x faster than alternate approaches. XtractIM offers unparalleled accuracy with full-wave analysis and an available broadband option. Broadband optimized multi-stage models provide user verifiable accuracy. A unique assessment capability enables rapid identification of potential package performance issues. Single-die, multi-die and SiP designs are all supported with extraction of the full package or selected nets. Designs can incorporate flip-chip as well as wirebond attachment.

XtractIM Data Sheet in PDF format

XtractIM Applications:

	Developing IC package design guidelines and models for use in system-level analysis
	Generating IBIS package RLGC models with coupling
	Exporting SPICE RLGC single-stage models (including Pi or T circuits)
	Creating broadband multi-stage optimized models
	Visualizing potential package performance issues
	Providing package models with CPP headers to support chip-package codesign
	Handling single and multi-die designs including flip-chip and wirebond interconnect (both BGA and leadframe)
	Extracting models of entire packages or selected nets
	Supporting system-level SI/PI analysis by adding drivers, receivers and interconnects

XtractIM Advantages:

	Easy to set up and use
	RLC extraction 10x faster than any alternative
	Highest accuracy with included full-wave solver
	Broadest support of IC package and SiP implementations
	First ever package assessment visualization to rapidly pinpoint potential risks to deal with the needle-in-the-haystack issue
	Flexible pin grouping options to enable the user preferred model resolution
	Comprehensive extraction of entire design, including embedded passive components
	Accurately reflect coupling between signal, power, and ground nets for devices with varying topologies (asymmetric Pi or T circuits)
	Complete broadband solution with user-verifiable full-wave accuracy
	Compact broadband models (2% S-parameter model size) with time domain circuit simulation compatibility
	Broad EDA tool flow support and push-button integration with Sigrity's Unified Package Designer (UPD) for package physical design
	Flexible 2D / 3D visualization, plotting and spreadsheet data management

Evaluation

To learn more about XtractIM or to begin an evaluation, please contact us.


	Papers and Articles

		Press Release: "Sigrity Announces XtractIM Version 3.0 for IC Package Modeling"
		Paper: "Package Electrical Performance Assessment with XtractIM"
		Paper: "Electrical Modeling and Model Representations for Package Interconnects and Power Delivery Networks"


	Package Extraction and Rapid Assessment
	Package assessment simplified
	Accuracy through broadband frequencies


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