Unified Package DesignerTM (UPD)
is a comprehensive IC package design environment for single and multi-die
applications. Flip-chip and wirebond die attachment approaches are accommodated. System-in-package (SiP) applications including side-by-side, stacked and
package-on-package (PoP) implementations are fully supported. 3D visualization and checking simplifies design and improves manufacturability. Sophisticated electrical constraints are incorporated into UPD and push-button RLC
extraction is available as an option.