SIGRITY offers timely and accurate electrical analysis of high-performance chip
packages, MCMs, and high-speed PCBs. These analyses include:
Please contact us for more details on our technical
Frequency-dependent characterization of power and ground
systems of different configurations (power and ground plane arrangement, via and
decoupling capacitor distribution). Impedance of power and ground systems at various
locations. Resonance at chip-carriers, MCMs, cards and boards.
Decoupling capacitor placement for the reduction of impedance of power
and ground systems and the removal of package resonance.
Simultaneous switching noise in power/ground and signal distribution
systems. Effects of decoupling capacitors in reducing simultaneous switching noise.
Coupling between different signal nets and coupling between power/ground
and signal distribution systems.