SIGRITY offers timely and accurate electrical analysis of high-performance chip packages, MCMs, and high-speed PCBs. These analyses include:

• Frequency-dependent characterization of power and ground supply systems of different configurations (power and ground plane arrangement, via and decoupling capacitor distribution). Impedance of power and ground systems at various locations. Resonance at chip-carriers, MCMs, cards and boards.

• Decoupling capacitor placement for the reduction of impedance of power and ground systems and the removal of package resonance.

• Simultaneous switching noise in power/ground and signal distribution systems. Effects of decoupling capacitors in reducing simultaneous switching noise.

• Coupling between different signal nets and coupling between power/ground and signal distribution systems.