PowerSI provides fast and accurate full-wave electrical analysis
of integrated circuit (IC) packages and printed circuit boards (PCBs) to overcome increasingly challenging
and interrelated power, signal, and EMI issues. A broad range of studies can be readily performed with
PowerSI to identify issues such as trace and via coupling, power/ground bounce caused by simultaneously
switching outputs, and to identify design regions that are under or over voltage targets.
PowerSI supports extraction of frequency dependent network parameter models and enables visualization
of complex spatial relationships. PowerSI can be readily incorporated into popular PCB, IC package,
and system-in-package (SiP) design flows.