PowerSI provides fast and accurate full-wave electrical analysis of integrated circuit (IC) packages and printed circuit boards (PCBs) to overcome increasingly challenging and interrelated power, signal, and EMI issues. A broad range of studies can be readily performed with PowerSI to identify issues such as trace and via coupling, power/ground bounce caused by simultaneously switching outputs, and to identify design regions that are under or over voltage targets. PowerSI supports extraction of frequency dependent network parameter models and enables visualization of complex spatial relationships. PowerSI can be readily incorporated into popular PCB, IC package, and system-in-package (SiP) design flows.

	PowerSI Data Sheet in PDF Format
	PowerSI Applications:
	Establishing power delivery system (PDS) guidelines for IC package and boards Evaluating electromagnetic coupling between geometries to enable better component, via, and decap placement Extracting frequency-dependent S, Z, and Y parameters for PKG and board modeling for subsequent time domain SSN simulation Anticipating energy leaks with near-field ration display  Assessing decoupling capacitor strategies and verifying placement effects Performing what-if studies on potential design scenarios and stack-up options Analyzing DC performance to avoid IR drop and current hot-spots
	PowerSI Advantages:
	Proven through use on thousands of production designs Highly accurate even for designs with unusual plane structures Fast throughput with multi-processor support and options for distributed computing Ability to support large designs that include both package and board structures  Flexible visualization options including 3D fly through Extensive user control of port selection and abstraction management Strong HSPICE flow support Supports all popular PCB and package layout data formats
	Evaluation
	To learn more about PowerSI or to begin an evaluation, please contact us.