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Product Overview
Broadband SPICE
Unified Package Designer
Evaluation Request


PowerDCTM provides comprehensive DC analysis for today's low-voltage, high-current printed circuit board (PCB) and IC package designs and is available in with an integrated thermal analysis option to enable electrical and thermal co-simulation.  With PowerDC, critical end-to-end voltage margins can be assessed for every device to ensure reliable power delivery.  PowerDC quickly identifies areas of excess current density and thermal hot spots to reduce risk of field failure.  Unique features include sense line location optimization and the fastest available analysis of detailed structures to maximize performance and throughput.  PowerDC is highly automated with a streamlined checklist workflow.  Visualization options and DRC checks support rapid design improvements.
PowerDC Data Sheet in PDF format
SPICE, circuit models, broadband frequencies

PowerDC Applications:

Pinpointing IR drop and voltage distribution issues
Automatically identifying preferred voltage regulator module (VRM) sense line locations
Locating current hot spots that can lead to reliability problems
Identifying difficult to locate highly resistive routing neck-downs and finding the one via among thousands that will fail under stress
Co-simulating electrical and thermal performance to identify interrelated voltage and temperature impacts
Determining if it is possible to reduce plane layers without adding DC or thermal reliability risk
Assessing multi-structure designs PCB and package designs with along with chip level information
Considering what-if improvement options with interactive geometry editing
Broadband SPICE extractions; SPICE, HSPICE

PowerDC Advantages:

Easy to deploy workflow that is ideal for occasional users and experts
Only available electrical / thermal co-simulation environment to enable rapid assessment of the thresholds for both with unparalleled accuracy
Fastest available DC and thermal run times (even for large designs that include both package and PCB data)
Comprehensive easy-to-confirm DC and thermal design rule validation
Unique patent-pending automation to pinpoint the best remote sense line location provides results 10-20% better than alternative reasonable locations
Highly accurate even for complex designs with multiple voltage domains and complex plane structures
Comprehensive support for multi-structure designs including support for stacked die, multiple boards and all popular package types
Readily used in Cadence, Mentor, Zuken and Altium flows accepting a mix of CAD databases where needed for multi-structure design support
evaulate Sigrity power and signal integrity tools Evaluation
To learn more about PowerDC or to begin an evaluation, please contact us.



Papers and Articles

  Press Release:  "Sigrity Introduces Industry's First and Only Electrical and Thermal Co-Simulation Tool"
  Paper:  "Power Integrity Analysis Techniques to Get the Best System Performance at the Cheapest Cost"

  Article:  "The DC Design Squeeze"

  Paper:  "Power Integrity in System Design"

  Paper:  "Packaging a Supercomputer in a PCI Express Form Factor"




PowerDC Configurations


PowerDC electrical DC simulation introduced in 2005

PowerDC electrical and thermal analysis with co-simulation.  introduced in 2010.


   1997-2012 Sigrity, Inc.
  Modified: October 31, 2012

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