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OrbitIO Planner
Unified Package Designer
Evaluation Request
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Speed2000 signal & power integrity software for IC package & PCB

OrbitIO Planner helps chip and packaging teams assess gate to board level connectivity in a single environment. This enables IO and device placement decisions to be made in a full system context. OrbitIO Planner is easily deployed in Synopsys, Cadence, and Magma IC design flows and offers support for the most popular package and board design tools. Unlike iterative and spreadsheet based approaches, OrbitIO Planner enables decisions to be made and refined with the best available data thus reducing errors, complexity, and cost.
Speed2000 Data Sheet OrbitIO Planner Data Sheet in PDF format
electrical anaysis, power and ground siginal integrity

OrbitIO Planner Applications:

Planning chip-package-board designs in a unified environment
Making die pad and ball assignments in the full system context
Determining design feasibility early by considering size, placement, stack-up, etc
Planning complex IC packages with SiP, stacked, and PoP integration
Evaluating wire bond feasibility during pad ring layout
Simplifying flip chip IO for easier bump escape and RDL routing
Optimizing pad ring layout for application specific packaging
dynamic wave propagation

OrbitIO Planner Advantages:

Dynamic interaction utilizing data from IC, package, and board tools
Ability to eliminate cost and complexity associated with poor IO planning
Utilizes data from popular IC, package, and board layout systems
Powerful placement visualization and optimization capability
Vertically aware environment supporting stacked, SiP, and PoP designs
Comprehensive hierarchy management and multi-domain correlation
Can be readily used by non-experts
Evaluation
To learn more about OrbitIO Planner or to begin an evaluation, please contact us.

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