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Please select all the items that apply, and let us know how to contact you.

Target Products
Printed circuit boards
IC packages
Chips
Chip / package / board co-design

Target Applications
SI / PI / EMC analysis
Model extraction
High-speed parallel buses
High-speed serial links
Package physical design
IO planning

Target Issues
Increasing design complexity
Overcoming power delivery challenges
Incorporating new interfaces
Identifying problems earlier
Avoiding cross-domain problems (chip / package / board)
Reducing unit costs

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  Modified: October 31, 2012

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