CoDesign Studio is a comprehensive chip and package co-design environment for analyzing and improving the performance of the entire power delivery system.  Working with Sigrity's XcitePI, PowerSi and SPEED2000 simulators, CoDesign enables simultaneous co-simulation of the complete package and complete chip in a fully integrated environment.  This allows full consideration of distributed package effects that can directly impact chip performance.  CoDesign Studio ensures that chips shown to be functional during simulation and testing are also fully operational when placed into the actual package.

	CoDesign Studio Data Sheet in PDF Format
	CoDesign Studio Applications:
	Assessing the end-to-end power delivery system for complete designs including chip, package and board. Understanding the performance of various on-chip and on-package decoupling capacitor implementations. Analyzing designs in either the time or frequency domain. Determining if the target package will meet design goals. Identifying preferred IC bump pad distributions. Simulating simultaneous switching noise and ground / power bounce. Understanding interdependent chip-package-board behavior.
	CoDesign Studio Advantages:
	Support for popular chip, package and board design flows. Flexible mix of analysis options both time and frequency domain at the chip, package and board level. Efficient single workspace for simulation along with 2D and 3D results viewing. Highest accuracy for designs where power integrity issues can not be observed at the chip level alone. Full consideration of self and mutual RLC parasitics utilizing Sigrity's XtractIM. What-if assessment support to consider on- and off-chip decoupling capacitor implementations. Simultaneous chip-package-board analysis with support for fully distributed structure support.
	Evaluation
	To learn more about CoDesign Studio or to begin an evaluation, please contact us.