| Technical
Papers |
|
Published
Technical Reports and Unsolicited White Papers
|
| 1. |
Effective Decoupling
Radius of Decoupling Capacitor
 [epep2001_Chen]
Decoupling capacitors on packages and printed circuits
boards are often essential to reduce
voltage fluctuations and maintain
power and signal integrity. This paper presents a method
for the evaluation of effectiveness of
decoupling capacitors placed on package or board structures.
Paper
(PDF Format)
Presentation (HTML Format)
|
| 2. |
Signal Integrity
[EMC-IEEE]
Book Chapter, Engineering Electromagnetic Compatibility, Second Edition,
IEEE Press and John Wiley & Sons, Inc., 2001
In this chapter, we will discuss what the typical signal integrity problems are, where they come from, why it is important to understand them and how we can analyze and solve these issues. Several software tools available at present for signal integrity analysis and current trends in this area will also be introduced.
Paper
(PDF Format)
|
| 3. |
Effects of 20-H Rule and
Shielding Vias on Electromagnetic Radiation From Printed
Circuit Boards
[epep_2000]
This
paper investigates the effects of the 20-H rule and
shielding vias on the radiation from printed circuit boards.
For the two-plane structure, 20-H rule yields much more
radiation than the normal structure. For the multiple plane
case, no significant change in radiation is found if the
20-H rule is applied to the internal planes. Also, the
numerical result shows that the usage of shielding vias
would cut down the radiation effectively.
Paper
(PDF Format)
Presentation (HTML Format)
|
| 4. |
Modeling
of the Electrical Performance of the Power and Ground Supply
for a PC Microprocessor on a Card
[epep98_amd]
October 26, 1998
Paper
(PDF Format)
|
| 5. |
Effects
of Power/Ground Via Distribution on the Power/Ground
Performance of C4/BGA Packages
[epep98_zhao]
October 26, 1998
Paper
(PDF Format)
|
| 6. |
Extraction
of Equivalent Circuit Models of Package Power Supply
Distribution Systems from Full Wave EM Field Simulations
[epep98_moll]
October 26, 1998
Paper
(PDF Format)
|
| 7. |
Validity
of Mutual Inductor Model for Electromagnetic Coupling
between Vias in Integrated-Circuit Packages and Printed
Circuit Boards
[ectc98]
May 25, 1998
Paper
(PDF Format)
|
| 8. |
Where to
Place Decoupling Capacitors ? -- Answer to a Problem Posted
on SI-List
[reply]
February 13, 1998
Discussion
(HTML Format)
|
| 9. |
Shorting
Via Arrays for the Elimination of Package Resonance to
Reduce Power Supply Noise in Multi-layered Area-Array IC
Packages
[ipdi98]
February 2, 1998
Paper
(HTML Format) |
| 10. |
Significance
of Electromagnetic Coupling Through Vias in Electronics
Packaging
[epep97]
October 27, 1997
Paper
(HTML Format) |
| 11. |
The
Facts about the Input Impedance of Power and Ground Planes
[inputimp]
July 31, 1997
Paper
(HTML Format) |
| 12. |
Reduction of Power and Ground Noise Coupling in Mixed Signal Modules
[epep96]
October, 1996
Paper
(PDF Format)
Presentation (HTML Format) |
| 13. |
Optimum
Placement of Decoupling Capacitors on Packages and Printed
Circuit Boards Under the Guidance of Electromagnetic Field
Simulation
[ectc96o]
May 28, 1996
Paper
(PDF Format) |
| 14. |
Measurement
and Simulation of Simultaneous Switching Noise in the
Multi-Reference Plane Package
[ectc96m]
May 28, 1996
Paper
(PDF Format) |
| 15. |
Extraction
of Transient Behavioral Model of Digital I/O Buffers from
IBIS
[ectc96ibis]
May 28, 1996
Paper
(PDF Format) |
| 16. |
A New
Approach to Signal Integrity Analysis of High-Speed
Packaging
[epep95]
October 2, 1995
Paper
(PDF Format) |
