SIGRITY offers timely and accurate electrical analyses of high-performance chip packages, MCMs, and high-speed PCBs. These analyses include:
Frequency-dependent characterization of power and ground supplier systems of different configurations (power and ground plane arrangement, via and decoupling capacitor distributions). Impedance of power and ground systems at various locations. Resonances at chip-carriers, MCMs, cards and boards.
Decoupling capacitor placement for the reduction of impedance of power and ground systems and the removal of package resonances.
Simultaneous switching noise in power/ground and signal distribution systems. Effects of decoupling capacitors in reducing the simultaneous switching noise.
Coupling between different signal nets and coupling between power/ground and signal distribution systems.
Please contact us for more details on our technical services.
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Sigrity, Inc.
Last modified:
January 17, 2010