Company Info

Job Openings   consider SIGRITY! Product Info SPEED2000 Info  PowerSI Brochure Broadband SPICE Brochure Product Feature Presentation Discover Broadband SPICE Auto-Combine package & PCB to form complex 3D structure for system simulation; and more.  (Flash 6 & Audio required, need 256MB memory to play)

Product Updates for Customer Customer Login Sign up with our mailing list and customer forum FREE Demo SPEED2000 Demo Download

You have no Java! You might be an Amiganer :-)

SPEED2000 Used in the Development of Intel's Breakthrough Packaging Technology (BBUL)  -- By S. N. Towle, H. Braunisch, C. Hu, R. D. Emery, and G. J.  Vandentop, Intel Corp. (Intel press release) Achieving 3.2 Gb/s, 400 MTS AGTL+ IO Through Robust Power Delivery Design With Minimal Package Size -- by Chee-Yee Chung, Weimin Shi and Alex Waizman,  Intel Corp.; DesignCon 2002 - High Performance System Design Conference, Santa Clara, CA, Jan. 29/30, 2002. IEEE ECTC-2001 Conference Papers Tout SIGRITY's SPEED2000 Products...   Three papers presented by  Intel Corporation show how our customers successfully applied our SPEED2000 software during signal, power, and ground integrity analysis for their most advanced designs. Signal Integrity -- Raymond Y. Chen, Sigrity, Inc. [EMC-IEEE] Book Chapter, Engineering Electromagnetic Compatibility, Second Edition, IEEE Press and John Wiley & Sons, Inc.,  2001 In this chapter, we will discuss what the typical signal integrity problems are, where they come from, why it is important to understand them and how we can analyze and solve these issues. Several software tools available at present for signal integrity analysis and current trends in this area will also be introduced.