Press Release
For
Immediate Release
Sigrity Introduces New
Suite of Tools to Streamline Package Analysis
SpeedPKG Suite's Breakthrough XtractIM Module Cuts
Time to Generate Electrical Models of IC Packages from
Days/Hours to Hours/Minutes
SANTA CLARA, Calif., October
23, 2006 — Sigrity, Inc., the market leader in
signal and power integrity software solutions, today
announced SpeedPKG Suite, a suite of analysis tools
customized for integrated circuit (IC) package
applications and designed to enable fast, easy, accurate
and complete electrical characterization. In addition,
the company announced availability of the first of many
SpeedPKG modules, XtractIM, which helps IC package
design teams assess package electrical performance
issues tens of times faster than the fastest
competitive offerings, and reduce time to market.
Rather than using static and
quasi-static solvers to extract package RLGC parameters as
do other tools currently on the market, XtractIM extracts
package models from S parameters computed by full-wave field
solvers, fully taking into account various electromagnetic
interactions. Unlike other tools that have to use symmetric
circuit structures to represent non-symmetric physical
structures, XtractIM correctly represents the non-symmetric
nature of the physical structures by generating
non-symmetric Pi and T type SPICE models according to system
network (S, Z or Y) parameters. This approach results in
more accurate model response in a broader frequency range,
without increasing the size of the SPICE model. With
Sigrity's proprietary hybrid electromagnetic solutions,
XtractIM requires only hours or minutes to run -- a
significant reduction compared to the days or hours needed
by other tools.
With its specialized workflow that
makes the tool easy to use and deploy, XtractIM is ideal for
package design team engineers involved in modeling and
characterization who need to provide IBIS (I/O Buffer
Information Specification) models or SPICE circuit netlists
to their customers and/or other internal groups such as IC
groups or reference board design groups. It also benefits SI
engineers who need to develop solid package design
guidelines, and package layout engineers in package design
teams who must follow design guidelines and perform design
rule checking.
Named for the extraction
of IBIS and SPICE circuit models
of IC packages, XtractIM extracts the most common electrical
models of IC packages according to IBIS, which is used to
assess the electrical performance of IC packages. It can
also export SPICE netlists of electrical models for
system-level analysis including drivers, receivers and
interconnects. It generates the IBIS package RLC matrix
model with coupling between signal, power and ground nets,
as well as the SPICE-equivalent circuits of package RLGC
models of different topologies (Pi or T circuit topology),
including coupling between signal, power and ground nets.
Customized reports and displays minimize user setup time and
the efforts required to obtain desired results.
The XtractIM solution is designed to
handle both flip-chip packages and wirebond packages of 3D
wirebond profiles, and can extract models of a full package
or selected nets of a package. XtractIM also can interface
with data files in various formats, including upd, mcm, na2,
dsn, and spd. Unlike other package model extraction tools on
the market that can only handle bare packages, XtractIM is
the only solution in which the complete physical structure
and all the lumped components mounted on the package can be
included in the extraction of package models. Inclusion of
on-package decoupling capacitors is critical to obtain
correct modeling of package power and ground systems, as
well as the coupling among signal, power and ground nets.
Pricing and
Availability
XtractIM is available now, with
pricing and licensing options obtained through Sigrity sales
representatives.
About
Sigrity
Sigrity, Inc., a privately held U.S.
company incorporated in 1998, delivers advanced software
solutions for package physical design and for analyzing
power and signal integrity in chips, packages and printed
circuit boards. Sigrity’s patented electrical analysis
methodologies run orders of magnitude faster than
general-purpose electromagnetic tools, helping leading
companies in the semiconductor, computer, graphics,
communications and networking industries ensure high
performance and reduce time to market. The company is
headquartered in Santa Clara, Calif., with a direct sales
force and representatives worldwide. For
more information about how to ensure operational designs by
using Sigrity’s package physical design and power and
signal integrity analysis solutions, please contact Sigrity
.
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