Press Release
For
Immediate Release
Agere Systems Adopts
Sigrity's Unified Package Designer for Single and Multi-die
Package Design
Sigrity Delivers Enabling Functionality to Meet the
Challenges of Advanced Packaging
SANTA CLARA, Calif. August 3,
2006 —Sigrity, Inc., the market leader
in signal and power integrity software solutions,
today announced Agere Systems, a global leader in
semiconductors for storage, wireless data and enterprise
networks, had adopted Unified Package Designer (UPD) for
use in the design of its advanced semiconductor packages.
Agere chose UPD due to the strength of its advanced
feature set to support their complex requirements,
primarily related to single and multi-die wirebond
designs. UPD supports a number of advanced package
configurations including: stacked-die, flip chip, chip
scale, and system-in-package.
"Given our long-term success with
the Encore product and its technology acquisition by
Sigrity, we felt it advantageous to migrate to UPD to
maintain support continuity and access to its evolving
feature set," said Rick Sergi, Manager of the IC Package
Design Group at Agere Systems. "We are very encouraged
by Sigrity's commitment to provide new and enabling
functionality for advanced package design and to add
these to the solid foundation already existing in the
core product. In addition, we look forward to the
introduction of advanced, cross-domain capabilities that
Sigrity's expertise in the area of co-design
methodologies promises."
"Agere's decision to migrate to
UPD signifies the importance of continued support and
maintenance while developing some very sophisticated
packages," said Dr. Jiayuan Fang, President of Sigrity.
"We're very pleased Agere has selected UPD and look
forward to their guidance and direction as we develop
advanced capabilities for stacked and multi-die package design.”
About Sigrity
Sigrity, Inc., a privately held U.S. company incorporated in 1998, delivers advanced software
solutions for package physical design and for analyzing power and signal integrity in chips, packages and
printed circuit boards. Sigrity’s patented electrical
analysis methodologies
run orders of magnitude faster than general-purpose
electromagnetic tools, helping leading companies in the semiconductor,
computer, graphics, communications and networking industries ensure high performance and reduce time to market.
The company is headquartered in Santa Clara, Calif., with direct sales and global distribution through
worldwide representatives. For more information about how
to ensure operational designs by using Sigrity's package
physical design and power and signal integrity analysis
solutions , please visit:
http://www.sigrity.com
Sigrity, the Sigrity logo, CoDesign Studio, Speed2000, and XcitePI are
trademarks of Sigrity, Inc
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