Press Release
For
Immediate Release
Sigrity's New Physical
Design Solution Accelerates Throughput and Reduces Design
Errors in High-Density Packages
Unified Package Designer™
tackles complex IC package design by
combining best-in-class layout with new 3D design rule
checking and viewing capabilities
SANTA CLARA, Calif., March 27, 2006
— Sigrity, Inc., the market leader in power and signal
integrity software solutions, today announced Unified
Package Designer (UPD), a new physical design product
for single and multi-chip advanced IC packages. Using
packaging-specific algorithms, it automates the
difficult and time-consuming tasks associated with flip
chip and wirebond designs, and ensures designs meet all
electrical, manufacturing and reliability requirements.
This approach helps designers design IC packages
correctly the first time, speeding development. UPS's
robust design capability supports a wide variety of
package configurations including stacked-die, flip chip,
chip scale, and system-in-package.
UPD builds on the core Encore package
design technology that Sigrity acquired from Synopsys two
months ago. It adds new 3D design rule checking (DRC) and
viewing capabilities, along with a tight linkage to
Sigrity's SpeedXP tool suite that handles pre- and
post-layout power and signal integrity analysis, decoupling
capacitor placement evaluation, and synthesis of highly
accurate SPICE models from multi-port S parameters. UPD
provides capabilities such as 3D modeling and checking that
are necessary for accurately representing the multi-tier
interactions common in today's stacked-die and high-density
wirebond designs, and ensuring manufacturability.
Jiayuan Fang, president of Sigrity,
commented: “UPD, with its advanced capabilities for 3D
packages, enables companies to handle even the most complex
physical design challenges, and produce high-quality designs
for manufacturing in the shortest time cycle. Sigrity is
fully committed to develop the best-in-class tools to help
customers ensure success of their increasingly complex
package and system-in-package designs.”
Availability
UPD is available now. The new 3D
checking and viewing capabilities are included in all UPD
licenses at no additional cost. Sigrity is offering a
special transition program that provides Encore users a
growth path to Unified Package Designer. Full details are
availablre through Sigrity Sales.
About
Sigrity
Sigrity, Inc., a privately held U.S.
company incorporated in 1998, delivers advanced software
solutions for package physical design and for analyzing
power and signal integrity in chips, packages and printed
circuit boards. Sigrity’s patented electrical analysis
methodologies run orders of magnitude faster than
general-purpose electromagnetic tools, helping leading
companies in the semiconductor, computer, graphics,
communications and networking industries ensure high
performance and reduce time to market. The company is
headquartered in Santa Clara, Calif., with direct sales and
global distribution through worldwide representatives. For
more information about how to ensure operational designs by
using Sigrity’s package physical design and power and signal
integrity analysis solutions, please visit:
http://www.sigrity.com
.
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