Sigrity Breakthrough Solution Optimizes Performance of Chip/Package
Power Delivery Systems
CoDesign Studio™ is First Solution to Co-Simulate
Complete Package and Chip Together
SANTA CLARA, Calif., May 16, 2005 —Sigrity, Inc., the market leader
in power and signal integrity software solutions for integrated circuits, IC packages and printed circuit boards,
today announced CoDesign Studio, a complete chip and package co-design solution for analyzing the performance
of the combined power delivery system. CoDesign Studio is the first EDA solution to simultaneously co-simulate
the complete chip and entire package in an integrated design environment. It leapfrogs existing power integrity
tools by including all package effects that impact the correct operation of the chip.
Sigrity’s unique co-design methodology ensures that ICs are operational when they are placed into actual packages,
preventing costly respins, and potentially saving millions of dollars for companies in the semiconductor,
computer, graphics, communications and networking industries.
Unlike other EDA tools, the CoDesign Studio solution analyzes power integrity of the
entire chip and package power delivery system. This comprehensive approach combines Sigrity’s proven flagship
SPEED2000™ solution for defacto-standard electrical analysis of packages, with the company’s XcitePI™ solution
for complete IC power grid analysis.
Jiayuan Fang, president of Sigrity said, “Power integrity issues continue to be a
critical concern for high-speed designs. Most current EDA tools inadequately represent chip/package interactions,
often leading to incorrect or misleading power analysis results. Sigrity helps companies overcome these deficiencies
by co-simulating the complete chip and entire package to ensure correct operation and reduce design iterations.”
Simultaneous chip-package co-simulation
Sigrity’s proprietary computational techniques take into account the complete self
and mutual parasitics of the chip and all electromagnetic interactions within the package.
CoDesign Studio performs chip and package co-simulation of dynamic power integrity analysis to
achieve fast and accurate results. The intelligent “what-if” analysis in the chip-package co-design
environment provides engineers with a variety of design choices, including chip and package decoupling
capacitor placement, package selection, IC floorplan placement, and IC bump and power grid configuration.
Pricing and Availability
CoDesign Studio is priced from $30K for customers who already have Sigrity’s XcitePI and SPEED2000 products.
It will be available in June 2005.
Sigrity, Inc., a privately held U.S. company incorporated in 1998, delivers advanced software
tools that analyze power and signal integrity in chips, packages and boards. Sigrity’s patented methodologies
run orders of magnitude faster than general-purpose methods, helping leading companies in the semiconductor,
computer, graphics, communications and networking industries ensure high performance and reduce time to market.
The company is headquartered in Santa Clara, Calif., with direct sales and global distribution through
worldwide representatives. For more information, please access:
Sigrity, the Sigrity logo, CoDesign Studio, Speed2000, and XcitePI are
trademarks of Sigrity, Inc