SIGRITY Press Release
For
Immediate Release
SIGRITY
Enters the High-Speed IC Market
with Breakthrough Power Integrity Solution
XcitePI Overcomes Packaging Bottleneck; Helps Prevent Chip Failure, Respins
SANTA CLARA, Calif., May 17. 2004 – Sigrity, Inc., the recognized market leader
in power integrity solutions for chip packages and boards, today extended its expertise to high-speed ICs
by introducing XcitePI™, a groundbreaking tool that performs dynamic simulation of the full-chip power
grid structure with package effects to determine the severity of power integrity issues. The new tool
can help companies in the semiconductor, computer, graphics, communications and networking industries
eliminate costly respins for complex ICs, potentially saving millions of dollars on each design.
“Many companies face daunting signal integrity and power integrity design challenges as they try to
figure out what the noise effects are and where they are located, and then devise strategies to
eliminate them,” said Jiayuan Fang, president of Sigrity. “Success requires the ability to adequately
analyze the entire power delivery system – from chip to package to board – to ensure the integrity of
power delivery systems and prevent costly respins. That’s a unique capability Sigrity brings to the market,
due to our established work and success in power integrity solutions for boards and packages. Now we are
extending it to ICs.”
Fast Simulation of Power Grid with Package Effects
Unlike existing power analysis
tools that consider only the resistive, capacitive and limited inductive coupling effects of the power
grid with lumped RLC off-chip models, Sigrity’s XcitePI tool analyzes the power grid with distributed
electromagnetic field propagation effects of the package, and capacitive and inductive coupling between
all conductors of the IC power grid. Once noise is generated at certain locations of a chip, it
often propagates more easily to other locations of the chip through the package power and ground
structures rather than directly through the power grid itself. Lumped RLC off-chip models cannot
adequately model such effects; leaving corresponding software tools unable to determine the true
transient noise distribution and behavior in the power delivery system. In contrast, XcitePI
performs transient analysis of the IC power grid simultaneously with dynamic simulation of
electromagnetic fields in the package planes, taking into account both the wave propagation
effects in the package and distributed interaction of the IC power grid and package planes.
XcitePI uses the fastest known simulation engine, especially designed for power grids,
to accomplish transient simulation of the full-chip power grid with package planes.
It enables chip and package design engineers to find noise voltage fluctuations; assess
the effects of decoupling capacitors, power grid physical parameters and package power
and ground planes; and conduct “what if” analysis to optimize their designs. The initial
release of XcitePI addresses design and analysis of IC power delivery systems.
Pricing and Availability
Available during the third quarter of 2004, XcitePI is priced from U.S. $65,000 for a
one-year time-based license. This price is a promotional limited time offer.
You can view the XcitePI data sheet for more information on its features
and functionality. For a more in-depth view of XcitePI and other Sigrity tools,
sign-up for our demo sessions
at DAC, June 7-10, 2004 in San Diego.
About Sigrity
Sigrity, Inc., a privately held U.S. corporation incorporated in 1998, is the technology leader in advanced software tools and services that extend the capabilities of a multiplicity of silicon-package-board design flows. Sigrity’s advanced analysis tools for power delivery systems and signal integrity have been adopted by leading companies in the computer, networking, communications, and consumer electronics markets.
Corporate headquarters are located at
4675 Stevens Creek Blvd., Suite 130
Santa Clara, CA 95051.
Sigrity has direct sales and global distribution through worldwide representatives.
URL: http://www.sigrity.com
For more information, please contact:
Teo Yatman
Sigrity, Inc.
(408) 260-9344 ext. 115
tyatman@sigrity.com
Sigrity, XcitePI and the Sigrity logo are trademarks of Sigrity, Inc. All other trademarks or registered trademarks mentioned in this release are the intellectual property of their respective owners.
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