SIGRITY Press Release

For Immediate Release

Announcing SpeedXP – The Next Generation Electrical Analysis Tool Suite for High-Speed Printed Circuit Boards and IC Packages

SANTA CLARA, Calif. — Mar. 1, 2002 — SIGRITY, INC. today announced the release of a new generation tool suite, SpeedXP, for fast and accurate full-wave electrical analysis of leading-edge Integrated Circuit (IC) packages and Printed Circuit Boards (PCBs).  SpeedXP includes Sigrity’s flagship product, SPEED2000, optimized to run in the time-domain, and its newly released tool, PowerSI, customized for frequency- domain analysis.

With the increase in circuit speed and data transmission rates, signal and power integrity are becoming some of the most challenging issues in the design of high performance PCBs and IC packages.  SpeedXP enables designers to quickly and accurately predict and optimize the electrical performance of IC packages and PCBs with unparalleled speed and accuracy required to meet the challenges of shorter design cycles, faster speeds and higher quality products.

SpeedXP’s extremely efficient electromagnetic analysis techniques are ideal for modeling entire IC packages or PCBs with full-wave accuracy. SpeedXP’s ultra high-performance stems from SIGRITY’s unique patented methodologies which allow for fine numerical meshes to be used when accurately modeling detailed structures such as cuts and slots in planes, multiple power and ground layer structures, and any number of vias and traces.

The SpeedXP tool suite employs the electromagnetic analysis technology embedded in SIGRITY’s flagship product, SPEED2000, which has been adopted by worldwide leading companies as well as high-tech start-ups for the design, modeling and simulation of high-speed integrated circuits, chip packages and printed circuit boards.  Visit our website to see the success stories and publications from our customers who have used SIGRITY technology to “achieve what others can’t”.  The SpeedXP tool suite components, PowerSI and SPEED2000, share the same data format and run in similar user interfaces, each providing the best solutions optimized for the frequency domain and time domain, respectively.

Sigrity’s newly released PowerSI can be used to:

•  Perform pre-layout and post-layout electrical analyses

•  Extract frequency-dependent impedances of power and ground systems of any number of layers and complex structures

•  Optimize decoupling capacitor placement

•  Identify package and board resonance

•  Analyze signal return path discontinuities

•  Evaluate electromagnetic coupling between different components (planes, traces, and vias)

•  Determine frequency-dependent S, Z and Y network parameters

•  Perform what-if comparisons to optimize electrical performance

Broadband SPICE^™, a new software module planned for release in Q2 of 2002, provides the transformation of S-parameters to broadband SPICE circuits, which can subsequently be used by conventional circuit solvers such as HSPICE.

Components

The SpeedXP tool suite includes SPEED2000, PowerSI, interfaces to layout tools of major EDA vendors, Broadband SPICE^™ (available Q2/2002), and has its own graphics editor to create and revise physical structures.

Pricing and Availability

Contact SIGRITY or your local SIGRITY sales representative for pricing information or to arrange for an evaluation license. SpeedXP, PowerSI and SPEED2000 are available as perpetual or time-based licenses on the Windows platform. 

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