SI/PI Analysis for PCB and IC Package Design

In-design analysis (IDA) lets you perform earlier design analysis to uncover and correct problems before final verification and signoff. Using Cadence Sigrity Aurora with Cadence Allegro PCB and IC packaging design tools helps avoid the time-consuming process waiting for signal and power integrity (SI/PI) experts to inspect and correct your fully routed designs.

Instead, the PCB/package designers can use the same simulation engines the experts use directly in their design tool and simulate without leaving the design environment. You can find and correct general SI/PI problems on the fly, avoiding multiple respins while maintaining project schedules and budget.

cubes image

Easy-to-Use IDA Methodologies Integrated with Allegro Technologies Quickly Detect and Fix Potential Design Issues

Sigrity Aurora provides traditional SI/PI analysis for pre-layout, in-design, and post-layout PCB and IC package designs. Integrated with Allegro PCB Designer and Allegro X Advanced Package Designer, Sigrity Aurora users can start analyzing earlier in the design cycle using “what if” exploration scenarios to set more accurate design constraints and reduce design iterations.

Design Insight

Bridges the gap between design and analysis with IDA SI/PI analysis

Seamless Integration

Tightly integrates Sigrity analysis engines with Allegro implementation design canvas

Greater Productivity

Improves product performance through solution-space exploration

Intuitive UI

Empowers PCB and package designers to use same simulation engines as SI/PI experts directly in the design tool

Accelerate PCB and IC Package Design with IDA Methodologies to “Shift Left” Initial Simulation Tasks

Shift-Left PCB Analysis

Sigrity Aurora PCB analysis provides traditional SI/PI analysis for pre-layout, in-design, and post-layout PCB designs. Integrated with Allegro PCB Designer editing and routing technologies, Sigrity Aurora PCB analysis users can start analyzing early in the design cycle using “what if” exploration scenarios to set more accurate design constraints and reduce design iterations.

Sigrity Aurora PCB analysis reads and writes directly to the Allegro PCB database for fast and accurate integration of design and analysis results. It provides a SPICE-based simulator and the patented Sigrity embedded hybrid field solvers for extraction of 2D and 3D structures. It also supports power-aware IBIS (behavioral) models, as well as transistor-level models, if needed. High-speed signals can be explored pre-layout, to compare alternatives, or post-layout, for a comprehensive analysis of all associated signals.

Features

  • DC PI Analysis Visualized on the Design Canvas:
    Measure any voltage drop between the source and the sink and visualize the results on the design canvas as voltage, voltage drop, or current density
  • Signoff Accuracy:
    Deliver products on time and within budget with a 10X performance increase while maintaining the trusted accuracy for which Sigrity tools are known
  • Enhanced Usability:
    Provides access to Sigrity Aurora PCB analysis from the design engineer and layout designer’s desktop, making analysis results actionable with real-time design edits

Electronical Performance Analysis for IC Packaging

Sigrity Aurora IC package analysis provides traditional SI/PI analysis for pre-layout, in-design, and post-layout IC package designs. Integrated with Allegro X Advanced Package Designer editing and routing technologies, Sigrity Aurora IC package analysis enables users to start analyzing early in the design cycle using “what if” exploration scenarios to set more accurate design constraints and reduce design iterations.

Sigrity Aurora IC package analysis reads and writes directly to the Allegro X Advanced Package Designer database for fast and accurate integration of design and analysis results. It provides a SPICE-based simulator and the patented Sigrity embedded hybrid field solvers for extraction of 2D and 3D structures. It supports power-aware IBIS (behavioral) models, as well as transistor-level models, if necessary. High-speed signals can be explored pre-layout to compare alternatives or post-layout for a comprehensive analysis of all associated signals.

Features

  • Design Setup Workflow:
    Set up a design in Allegro X Advanced Package Designer for full-package reflection and crosstalk simulations, as well as interconnect extraction, materials and cross-section details, DC (power) net identification, default and specific simulation models, and differential pair management
  • Interconnect Model Extraction:
    Streamlines full-wave 3D interconnect model extraction with support for distributed computing, fully automatic port definitions and de-embedding, and the ability to view 3D geometry and S-parameters
  • Analysis Screenings:
    Impedance, coupling, reflection, crosstalk, IR drop, and more