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2010 News
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2010
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2009
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2005
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2004
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2002
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Sigrity Introduces
Industry's First and Only Electrical and Thermal
Co-Simulation Tool
--January 28,
2010
New PowerDC thermal simulation fully considers both die
heating and copper heating on IC packages and printed
circuit boards. These temperature effects are
co-simulated with DC current density analysis to maximize
accuracy while reducing the iterative steps associated with
separate thermal and electrical simulations.
Press Release
Additional
PowerDC Information |
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Sigrity Moves to a New
Office
--January 18,
2010
Our headquarters location and training center has moved
from Santa Clara to Campbell. Our new address is 900
E. Hamilton Avenue, Suite 500, Campbell, CA 95008. Our
new phone number is (408) 688-0145.
Map and directions |
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Sigrity Recognized as a
DesignVision Award Finalist
--January 12,
2010
The IEC names Sigrity's Channel Designer product as one of
the most beneficial contributions to the electronic design
industry as a 2010 Design Vision Finalist. Channel
Designer was selected from more than 105 submissions.
Sigrity
Awards
Additional Channel Designer Information |
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