Sigrity's 8.0 Release Information

July 21, 2008

With SpeedXP 8.0, Sigrity is introducing user-customizable workflows to enhance productivity for both new and experienced users.  Sigrity is providing seven default workflows for use with PowerSI and SPEED2000 covering topics such as a model extraction workflow, power ground noise simulation workflow and EMC/EMI simulation workflow.  Sigrity provided workflows can be tuned to adapt to individual / team preferences and users can also easily create their own workflows.

ENHANCEMENT SUMMARY

Here is a quick feature summary.   Software releases are available for electronic download at Sigrity's Customer Sign-In area. 
Primary user contacts have account user name and password information.   Password retrieval is available at the SPDnet site.

SpeedXP (8.0 Production Release)

Overall SpeedXP capability:

• Customizable workflows ... for user defined and Sigrity provided out-of-the box workflows to streamline user activity
• Model Connection Protocol (MCP) ... Sigrity-developed open format that is useful to easily connect chip, package and board models
• Material library for metals and dielectrics ... for efficient handling of temperature dependent material effects
• Unified circuit manager ... for dockable viewing panes with typical functions and views, consistent across products
• Usability options ... Tip of the Day, layout editing, via shape handling, zoom control, image export

SPEED2000 users will see:

• SPEED2000 provided workflows ... for SSO simulation, Power/Ground noise simulation, EMC/EMI simulation, device model simulation
• Waveform analysis functions ... eye diagram extensions, waveform linking and measurement enhancements
• Trace voltage visualization ... signal waveform propagation through a net with 3D animation

PowerSI users will see:

• PowerSI provided workflows ... for model extraction, hot spot (resonance detection), EMC/EMI simulation
• Broadband Network Parameter (BNP) viewer ... for visualization and post processing of extracted data (link to viewer)
• Compressed S-parameter output ... produces file sizes 100x smaller than zipped TouchStone files

PowerDC users will see:

• Multi-board analysis ... streamlines broader system IR drop assessment and DC sign-off
• SPICE model support ... to import and generate SPICE models with a wizard that includes MCP header information
• Usability options ... plane current density vector display, constraint management simplification

Broadband SPICE users will see:

• Enhanced accuracy ... improved impedance fitting for DC at open ports
• Flow support ... automatic launch from within PowerSI

XtractIM / SpeedPKG Suite (1.3 Production)

Improvements to XtractIM in the newest production release:

• Die-to-die wirebond extraction ... supports extraction for additional SiP implementations
• Leadframe package extraction ... incorporates leadframe metal and wirebonds, DXF import and set-up

OptimizePI / SpeedPCB Suite (1.1 Production)

Improvements to OptimizePI in the newest production release:

• Time domain verification ... confirmation of impedance based assessment results
• Enhanced decap library options ... library wizard, search functions, external and project specific decap library support
• More decap selection flexibility ... name-based and mouse controlled group editing
• Peak resonance handling ... new linear-based approach in addition to logarithm based method for reducing peaks
• Usability options ... what-if assessment improvements for visualizing multiple elements and selective incremental reset

Unified Package Designer (8.0 Production)

Improvements to UPD in the newest production release:

• High speed design ... skew monitoring
• Enhanced package extraction ... automated XtractIM launch from inside UPD
• Free UPD design viewer UI ... simplified navigation for casual users (link to viewer)