SIGRITY News
Sigrity
Makes First Customer Shipment of Breakthrough Chip-Package
Co-Design Solution
XcitePI
maximizes complete power system performance through combined full-chip
and package analysis
SANTA CLARA, Calif., October 22, 2004
– Sigrity, Inc., makes its first customer shipment of XcitePI™,
a groundbreaking tool that performs dynamic simulation
of the full-chip power grid structure
with package effects to determine the severity of power integrity
issues. XcitePI helps companies in the semiconductor, computer,
graphics, communications, and networking industries achieve
time-to-profit goals by avoiding costly design iterations.
“Many
companies face increasingly severe signal integrity and
power integrity design challenges as they try to figure out
what the noise effects
are and where they are located, and then devise strategies
to eliminate them ”
said Jiayuan Fang, president of Sigrity. “Success
requires the ability to adequately analyze the entire power delivery
system – from chip to package
to board – to ensure the integrity of power delivery systems
and prevent costly respins. That's a unique capability Sigrity
brings to the market, due to our established work
and success in
power integrity solutions for boards and packages.
Now XcitePI’s chip-package co-design solution is addressing IC power
analysis.”
Fast Simulation of Power Grid with Package Effects
Unlike
existing power analysis tools that consider only the
resistive, capacitive,
and limited inductive coupling effects of the power grid
with lumped RLC off-chip models, Sigrity’s XcitePI tool
analyzes the power grid with distributed electromagnetic
field propagation effects of the package, and capacitive and
inductive coupling between all conductors of the IC power
grid. Once noise is generated at certain locations of a
chip, it often propagates more easily to other locations of
the chip through the package power and ground structures
rather than directly through the power grid itself.
Lumped RLC or S-parameter off-chip models cannot
adequately model such effects; leaving corresponding
software tools unable to determine the true transient noise
distribution and behavior in the power delivery system. In
contrast, XcitePI performs transient analysis of the IC
power grid simultaneously with dynamic simulation of
electromagnetic fields in the package planes, taking into
account both the wave propagation effects in the package and
distributed interaction of the IC power grid and package
planes.
XcitePI uses the fastest known simulation engine and interactive
GUI, especially designed for power grids, to accomplish
ultra-fast and highly accurate extraction and transient
simulation of the full-chip power
grid with package planes. It
enables chip and package design engineers to find noise voltage
fluctuations; assess the effects of decoupling capacitors,
power grid physical parameters and package power and ground
planes; and conduct “what if” analysis to optimize the
pre-layout and floor planning stages of chip implementation.
Customers co-designing advanced, high performance ICs
using flip chip packages can benefit greatly from using
XcitePI.
Sigrity, the Sigrity logo, and XcitePI are trademarks of Sigrity, Inc.
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