|
2010 Events
|
|
2010
|
2009
|
2008
|
2007
|
2006
|
2005
|
2004
|
2003
|
|
|
|
 |
Electronic Design and Solution Fair 2010
-- Jan 28-29, Yokohama, Japan
Industry leading trade show and conference
covering all the technologies for tomorrow's semiconductor and system design solutions.
EDSF 2010 |
 |
DesignCon West
-- Feb 2-3, Santa Clara, CA (Santa Clara Convention Center)
Connecting the world of electronic
design.
DesignCon 2010
|
| |
Information on Sigrity
activities at DesignCon 2010 |
 |
Meptec
-- Feb 25, San
Jose, CA (Holiday Inn)
From Chip to System: Design
Challenges and Solutions.
Meptec Symposium |
 |
Sigrity Korea Customer Forum
-- April 13, Seoul Korea
Technology presentations describing
new Sigrity capabilities and user projects.
|
 |
European IBIS Summit
-- May 12,
Hannover, Germany
Forum to advance common modeling
and design practice.
|
 |
Electronic Components and Technology Conference (ECTC)
-- June 2-3,
Las Vegas, Nevada (Paris Hotel)
The premier international packaging, components,
and microelectronic systems technology conference.
60th ECTC |
 |
Sigrity Taiwan Customer Forum
-- Taipei, Taiwan
Presentations highlighting selected
applications and featuring user experiences.
|
 |
Design Automation Conference (DAC)
-- June 14-16,
Anaheim, CA (Convention Center)
The premier Electronic Design Automation and silicon solution event.
47th DAC |
 |
IEEE on EMC Symposium
-- July 25-30,
Fort Lauderdale, FL (Convention Center)
The annual IEEE conference for products, software,
services, and test equipment for difficult EMC design requirements and the latest EMC/EMI tools.
IEEE EMC 2010 |
 |
Sigrity Japan Customer Forum
-- September
16, Tokyo, Japan
Technology presentations describing
new Sigrity capabilities and user projects.
|
 |
PCB West
-- Sep 28-30,
Santa Clara, CA (Convention Center)
The premier West Coast conference and exhibition
for PCB design, engineering and manufacturing.
PCB West 2009
|
 |
Electrical Performance of Electronic Packaging and Systems (EPEPS)
-- Oct 24-27,
Austin, TX
The premier technical meeting on electrical considerations in packaging.
19th EPEP
|
 |
Asia IBIS Summit
-- Shanghai, China
Forum to advance common modeling
and design practices. |
 |
Japan IBIS Summit
-- Tokyo, Japan
Forum to advance common modeling
and design practices. |
 |
EDAPS IEEE Symposium
-- Hong Kong, China
IEEE conference focused on the
electrical design of advanced packages and systems. |
| |
|