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Sigrity Events

2010 Events
2010  |  2009  |  2008  |  2007  |  2006  |  2005  |  2004  |  2003  | 
Electronic Design and Solution Fair 2010
-- Jan 28-29, Yokohama, Japan
Industry leading trade show and conference covering all the technologies for tomorrow's semiconductor and system design solutions.
EDSF 2010
DesignCon West
-- Feb 2-3, Santa Clara, CA (Santa Clara Convention Center)
Connecting the world of electronic design.
DesignCon 2010
  Information on Sigrity activities at DesignCon 2010
Meptec
-- Feb 25, San Jose, CA (Holiday Inn)
From Chip to System:  Design Challenges and Solutions.
Meptec Symposium
Sigrity Korea Customer Forum
-- April 13, Seoul Korea
Technology presentations describing new Sigrity capabilities and user projects.
European IBIS Summit
-- May 12, Hannover, Germany
Forum to advance common modeling and design practice.
Electronic Components and Technology Conference (ECTC)
-- June 2-3, Las Vegas, Nevada (Paris Hotel)
The premier international packaging, components, and microelectronic systems technology conference.
60th ECTC
Sigrity Taiwan Customer Forum
-- Taipei, Taiwan
Presentations highlighting selected applications and featuring user experiences.
Design Automation Conference (DAC)
-- June 14-16, Anaheim, CA (Convention Center)
The premier Electronic Design Automation and silicon solution event.
47th DAC
IEEE on EMC Symposium
-- July 25-30, Fort Lauderdale, FL (Convention Center)
The annual IEEE conference for products, software, services, and test equipment for difficult EMC design requirements and the latest EMC/EMI tools.
IEEE EMC 2010
Sigrity Japan Customer Forum
-- September 16, Tokyo, Japan
Technology presentations describing new Sigrity capabilities and user projects.
PCB West
-- Sep 28-30, Santa Clara, CA (Convention Center)
The premier West Coast conference and exhibition for PCB design, engineering and manufacturing.
PCB West 2009
Electrical Performance of Electronic Packaging and Systems (EPEPS)
-- Oct 24-27, Austin, TX
The premier technical meeting on electrical considerations in packaging.
19th EPEP
Asia IBIS Summit
-- Shanghai, China
Forum to advance common modeling and design practices.
Japan IBIS Summit
-- Tokyo, Japan
Forum to advance common modeling and design practices.
EDAPS IEEE Symposium
-- Hong Kong, China
IEEE conference focused on the electrical design of advanced packages and systems.
   

 

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  Modified: February 01, 2010

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