Integrated Package Layout and Electrical Assessment

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The number of issue and importance of IC package-related is growing.  IC package costs now constitute a significant portion of the over all cost which make it critical to manage design decisions carefully from the outset.  From an electrical point of view, it is also critical to carefully manage performance.  The breadth of package implementations is growing and includes low cost leadframe packages through high end system-in-package (SiP) implementations.

In the past, design and analysis activities have largely been over-the-wall processes with package layout professionals concentrating on physical implementation and signal / power integrity experts performing package extraction and analysis as a final step.  In many cases a 3rd party package manufacturing supplier is involved in the design.  These factors make it difficult to fully understand how the package will perform under operational conditions until very late in the game.

This webcast profiles an approach pioneered by Sigrity that brings package design and electrical performance assessment together in a way that gives package layout team members actionable information to enable design improvement from the outset.  The webcast will last approximately 30 minutes and will include a live demonstration of Sigrity's Unified Package Designer (UPD) software.

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