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2009 Events
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2012
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2011
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2010
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2009
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2008
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2007
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2006
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2005
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2004
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2003
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Electronic Design and Solution Fair 2009
-- Jan 22, 23, Yokohama, Japan
Industry leading trade show and conference
covering all the technologies for tomorrow's semiconductor and system design solutions.
EDSF 2009 |
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DesignCon West
-- Feb 3-4, Santa Clara, CA (Santa Clara Convention Center)
Connecting the world of electronic
design.
DesignCon 2009
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Information on Sigrity activities at DesignCon 2009 |
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Sigrity Korea Customer Forum
-- April 21, Seoul Korea
Technology presentations describing
new Sigrity capabilities and user projects.
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Electronic Components and Technology Conference (ECTC)
-- May 27-28, San Diego, CA (Sheraton San Diego Hotel & Marina)
The premier international packaging, components,
and microelectronic systems technology conference.
59th ECTC |
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Sigrity Taiwan Customer Forum
-- June 2, Taipei, Taiwan
Presentations highlighting selected
applications and featuring user experiences.
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Information
on Sigrity Taiwan Customer Forum |
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Design Automation Conference (DAC)
-- July 27-30, San Francisco, CA (Moscone Center)
The premier Electronic Design Automation and silicon solution event.
46th DAC |
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For information and suite visit registration |
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IEEE on EMC Symposium
-- Aug 18-20, Austin, TX (Austin Convention Center)
The annual IEEE conference for products, software,
services, and test equipment for difficult EMC design requirements and the latest EMC/EMI tools.
IEEE EMC 2009
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PCB West
-- Sep 14-18 (TBD), Santa Clara, CA (Santa Clara Marriott)
The premier West Coast conference and exhibition
for PCB design, engineering and manufacturing.
PCB West 2009
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Sigrity Japan Customer Forum
-- Sept 16,
Tokyo, Japan
Technology presentations describing
new Sigrity capabilities and user projects.
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Electrical Performance of Electronic Packaging and Systems (EPEPS)
-- Oct 19-21, Portland, OR (Embassy Suites)
The premier technical meeting on electrical considerations in packaging.
18th EPEP
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Sign up for Monday evening customer party |
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Asia IBIS Summit
-- Nov 4, Shanghai, China
Forum to advance common modeling
and design practices. |
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Japan IBIS Summit
-- Nov 6,
Tokyo, Japan
Forum to advance common modeling
and design practices. |
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EDAPS IEEE Symposium
-- Dec 2-4,
Hong Kong, China
IEEE conference focused on the
electrical design of advanced packages and systems. |
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Sigrity speaker: Power integrity analysis techniques
to get the best system performance without adding cost. |
