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Sigrity at DesignCon 2009

We're looking forward to seeing you in early February. If you're looking for additional information, please visit our main web site at or contact us at

Sigrity DesignCon Booth Activities

We will be featuring recent advances relating to existing Sigrity products and introducing visitors to our newest product, Channel Designer™.

            Booth Number: 613
            Exhibit Hours: Tuesday and Wednesday, 12:30 pm - 6:30 pm
            Drawing: Wednesday afternoon at 5:00 pm

Notable Papers and Panels

Tuesday, February 3

System IO Planning and Design Feasibility - Challenges and Solutions ...Examination of trends driving coordinated system IO planning and practical approaches that cross chip, package and board domains.

            Time: 11:05 am - 11:45 am
            Session Number: A-TA4
            Author: Kevin Rinebold, Sigrity

TECHNICAL PANEL: High-Speed Channel Designs ...Strategies for handling chip-to-chip serial link communication to minimize jitter. The emergence of the IBIS Algorithmic Modeling Interface (AMI) standard will also be discussed.

            Time: 3:45 pm - 5:00 pm
            Chairperson: Moises Cases, IBM
            Speakers: Mohammad Ali, Broadcom; Kumar Keshavan, Sigrity; Nam Pham, IBM; Lawrence 
            Williams, Ansoft; Dmitry Smolyansky, Tektronix

Wednesday, February 4

Broadband Methodology for Power Distribution System Analysis of Chip, Package and Board for High-Speed IO Design ...Characterization utilizing frequency domain impedances to assess power delivery system coupling and the impact this has on simultaneous switching effects for adjacent IO cells.

            Time: 9:20 am - 10:00 am
            Session Number: A-WA2
            Authors: Hsing-Chou Hsu, VIA Technologies; Chi-Hsing Hsu, Azurewave Technologies; Jack Lin,

Time and Frequency Analysis of Signal Noise as a Function of Power Noise and Vice Versa of a Microcontroller (µC) Plus its Packaging (LQFP + PCB) ...Strategies for the assessment of signal and power integrity effects in complex systems. Simulations determine the impact of distributed on-chip and packaging decoupling capacitors.

            Time: 11:05 am - 11:45 am
            Session Number: 4-WA4
            Authors: Ekkehard Miersch, EFM-Consulting; Mehmet Goekcen, Infineon; Thomas Steinecke,

The Effects of Chip and Board Behavior on Package-Centric, System-Aware Power Delivery Design ...Chip and board electrical performance is assessed for four packaging approaches.

            Time: 2:50 pm - 3:30 pm
            Session Number: 4-WP2
            Authors: Virenda Adsure, Intel; Jiang Li, Sigrity; Long Wang, Intel

Thursday, February 5

Switching Voltage Regulator Noise Coupling Analysis for Printed Circuit Board Systems ...Switching voltage regulator noise is becoming an increasingly significant challenge for motherboard designers and can lead to system reliability issues. A methodology is discussed to anticipate and avoid issues before building boards.

            Time: 10:40 am - 11:20 am
            Session Number: 10-TH3
            Authors: Amy Luoh, Intel; Gene Garrison, Intel; Jon Powell, Intel


Complete DesignCon 2009 Schedule (link)



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