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2008 Articles |
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2008
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2007
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2006
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2005
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2004
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2003
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PCB Signal Integrity, Power Integrity and EMC Challenges
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PCD&F, December 1, 2008
For PCB and package designs, the issues of crosstalk, reflections,
skew, ringing and other classical signal integrity challenges are pervasive and
growing. A meaningful assessment of such effects requires system-level consideration
to reliability account for coupling among traces as well as planes, vias and other
design structures.
(Web Link ...)
(PDF Format)
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Packaging Goes Vertical
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EETimes, November 24, 2008
3D packages play a critical role in enabling
increased density and configurability without adding weight.
Implementations include stacked-die, package-on-package (PoP)
and through-silicon-via (TSV) packages. Targeted design planning,
analysis and layout considerations
require careful management to ensure success.
(Web Link ...)
(PDF Format)
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OptimizePI Version 1.2
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PCD&F, September 10, 2008
Sigrity introduces enhanced capabilities for OptimizePI at PCB West
in San Jose. New enhancements include a single-click option for optimization targeting
and a simplified flow for pre-layout analysis.
(Web Link ...)
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Will it Work?
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SOCcentral article presented as part a piece by Mike Donlin
looking at how "Manufacturing Concerns Move Up the Design Cycle", September 2, 2008
Without explicit design consideration of off-chip effects,
it is difficult to assure a chip design will operate properly in a customers system.
Design adjustments among the chip, package and even board physical domains can yield
power integrity performance enhancement as well as cost savings, while avoiding the
risk of chip failure when implemented in a system.
(Web Link ...)
(PDF Format)
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Sigrity Tool Development Interview by Andy Shaughnessy
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The Shaughnessy Report, an exclusive of PCBDesign007, August 6, 2008
Sigrity 8.0 enhancements and industry trends are discussed
including customization, Model Connection Protocol, SSN, Broadband Network
Parameter (BNP) viewer, power delivery specifications and design side EMC.
(audio link...)
(PDF interview transcript)
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Sigrity Adds Enhancements to Product Lineup
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PCB007, June 6, 2008
Sigrity has added new functionality to
its signal and power integrity analysis tools. Users will
see enhancements to SPEED2000, PowerSI, PowerDC, Broadband
SPICE, OptimizePI, XtractIM and Unified Package Designer (UPD).
(link...)
(PDF...)
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Power Up: A Power Integrity Design Approach
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XrossTalk Magazine, April, 2008
SI and PI have become inseparable due to the coupling between power planes and signal nets. (link...) |
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New power delivery system design practice
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PCB007, January 30, 2008
The design of PCB's power delivery system (PDS) is growing more complex each day. (link...) |
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