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Recent Articles |
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2011
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2010
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2009
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2008
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2007
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2006
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2005
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Sigrity Opens Four More Offices
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Printed Circuit Design & Fab, January 30, 2012
Sigrity extends local support capability for existing and
future customers with two new locations in China, a new
office in Israel, and a Southern California support
location. This coincides with the company's 15th consecutive
year of growth. (Web
Link ...) |
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Synopsys Collaborates with Sigrity to Accelerate Signal
Integrity Analysis
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EETimes, January 25, 2012
Design flows focused on SI/PI analysis often rely on
Sigrity EM field solvers to generate system level
interconnect models. These models along with semiconductor
models (transistor level models or iBIS models) are used in
a number of SI/PI flows that can incorporate HSPICE as an
engine. (Web
Link ...) |
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Sigrity Partners with TSMC on Referenced Flow 12.0
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SOCcentral, June 2, 2011
John Miklosz describes TSMC reference flow and the five
Sigrity tools that are part of TSMC reference flows. The
focus in TSMC reference flow 12.0 is to enable 3D IC
projects by enabling practical co-design options.
(Web Link ...)
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End-to-End Signal Analysis
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Electronic Design Journal, June 2, 2011
This article by Bryon Moyer describes I/O analysis and
compares traditional simulation approaches with new
techniques such as SystemSI - Parallel Bus Analysis
that consider multiple effects at the same time.
(Web Link ...)
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Sigrity Rolls Out SystemSI Signal Integrity Analysis
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Printed Circuit Design & Fab, June 1, 2011
This article Chelsey Drysdale covers the introduction of
SystemSI with a focus on parallel bus analysis.
(Web Link ...)
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Treat ICs, Packages and PCBs as System Designs
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Electronic Design, March 16, 2011
It can be challenging to design
reliable hardware systems. This article by David Maliniak covers complex and related issues including power
and signal integrity, electrical and thermal effects, chip /
package / pcb connectivity, etc. Sigrity's open Model
Connection Protocol is discussed.
(Web Link ...)
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