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| 2005 Articles |
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2010
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2009
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2008
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2007
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2006
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2005
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2004
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2003
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| From Sigrity
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Sigrity Announces the latest release of SpeedXP 4.2!
-- Feb. 11, 2005
SIGRITY announces the availability of its latest signal integrity tools--SpeedXP 4.2.
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| From Others |
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Various magazines cover the release of Sigrity's CoDesign Studio™
May, 2005
-- 05/20 Electronic News features CoDesigner in their
article, "Sigrity Targets Noise"
-- 05/16
EETimes Online in their article "Co-design solution links IC and package simulation"
-- 05/16
EDN in their article "Power-analysis tool sees into both IC and package"
-- 05/16 Printed Circuit & Design Manufacture Magazine,
"Sigrity Tool Simulates Chip, Package"
-- 05/16 SoC Central,
"Sigrity's CoDesign Studio Optimizes Performance of Chip/Package Power Delivery Systems"
-- 05/16 EDA Cafe
article highlights CoDesign Studio
-- 05/16 PerfectDisplay.com in their EDA Monthly News section
-- 05/16 EE Times features a second article, "Co-Design links chips, boards and packages"
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Printed Circuit Design & Manufacture Magazine
publishes Sigrity's article, "IR Drop in High-Speed IC Packages and PCBs" as their cover story written
by Sam Chitwood and Ji Zheng
-- PCB, April, 2005
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SOCentral publishes Sigrity's article, "On-Chip Power Integrity, Including Package Effects"
-- SOC, March 14, 2005
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Electronic News interviews Sigrity CEO, Dr. Jiayuan Fang regarding
the need for co-designing hardware and packaging in their article, "New Challenges in Design"
-- Electronic News, Feb. 11, 2005
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